Epoxy Resin L + Hardener S (15 min)
Epoxy Resin L + Hardener S (15 min)
Set of two components
- Free from nonylphenol, benzyl alcohol and DETA
- Low viscosity, solvent- and filler-free
- Fast impregnation of glass, aramid and carbon fibres
- High static and dynamic strength
- Low surface tension, good adhesion and low curing shrinkage
- Ideal for bonding wood, metal, Styropor® etc.
Epoxy resin L with the corresponding hardeners is the most frequently used laminating and bonding resin from the R&G product range.
Epoxy resin L with Hardener S has similar mechanical properties to the laminating systems commonly used in aircraft construction.
Processing time: 15 minutes (100 g / 20 °C)
Mixing ratio:
100 : 40 parts by weight Epoxy Resin L : Hardener S
100 : 45 parts by volume Epoxy Resin L : Hardener S
Curing time (at 23 °C): 16 - 24 hours
Cold hardening, hardens from 5 °C (low temperature hardener)
Heat distortion temperature: Approx. 65 °C
Processing:
It can be processed in all common processes such as hand lamination, pressure and vacuum impregnation as well as pressing and winding.
Material characteristics (pure resin cured) Epoxy Resin L with Hardener S:
| Flexural strength DIN EN ISO 178 in MPa | 110 |
| Bending E-modulus DIN EN ISO 178 in MPa | -- |
| Tensile strength DIN EN ISO 527 in MPa | 68 |
| Compressive strength DIN EN ISO 14126 in MPa | 116 |
CYTOX expert opinion on the Resin System Epoxy Resin L + Hardener S (see below under additional information): this system is not cytotoxic (cell-damaging), important for applications in medical technology.
Epoxy Resin L + Hardener S (15 min)
Set of two components
- Free from nonylphenol, benzyl alcohol and DETA
- Low viscosity, solvent- and filler-free
- Fast impregnation of glass, aramid and carbon fibres
- High static and dynamic strength
- Low surface tension, good adhesion and low curing shrinkage
- Ideal for bonding wood, metal, Styropor® etc.
Epoxy resin L with the corresponding hardeners is the most frequently used laminating and bonding resin from the R&G product range.
Epoxy resin L with Hardener S has similar mechanical properties to the laminating systems commonly used in aircraft construction.
Processing time: 15 minutes (100 g / 20 °C)
Mixing ratio:
100 : 40 parts by weight Epoxy Resin L : Hardener S
100 : 45 parts by volume Epoxy Resin L : Hardener S
Curing time (at 23 °C): 16 - 24 hours
Cold hardening, hardens from 5 °C (low temperature hardener)
Heat distortion temperature: Approx. 65 °C
Processing:
It can be processed in all common processes such as hand lamination, pressure and vacuum impregnation as well as pressing and winding.
Material characteristics (pure resin cured) Epoxy Resin L with Hardener S:
| Flexural strength DIN EN ISO 178 in MPa | 110 |
| Bending E-modulus DIN EN ISO 178 in MPa | -- |
| Tensile strength DIN EN ISO 527 in MPa | 68 |
| Compressive strength DIN EN ISO 14126 in MPa | 116 |
CYTOX expert opinion on the Resin System Epoxy Resin L + Hardener S (see below under additional information): this system is not cytotoxic (cell-damaging), important for applications in medical technology.